International Journal of Scientific Research and Engineering Development

International Journal of Scientific Research and Engineering Development


( International Peer Reviewed Open Access Journal ) ISSN [ Online ] : 2581 - 7175

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📑 Paper Information
📑 Paper Title Microstructural Analysis and Defect Characterization of WAAM-Fabricated Nitinol Shape Memory Alloy
👤 Authors Sangat Naik, Dr.Srinagalakshmi Nammi
📘 Published Issue Volume 9 Issue 1
📅 Year of Publication 2026
🆔 Unique Identification Number IJSRED-V9I1P128
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📝 Abstract
Wire Arc Additive Manufacturing (WAAM) has emerged as a promising metal additive manufacturing technique for fabricating large-scale components with high deposition rates and reduced material waste. However, processing shape memory alloys such as Nitinol using WAAM presents significant challenges due to their sensitivity to thermal cycling, composition variation, and defect formation. In this study, a detailed experimental investigation is carried out to analyze the microstructural characteristics and defect mechanisms in WAAM-fabricated Nitinol components. The influence of process parameters on porosity, cracking, and grain morphology is examined using stereo microscopy, optical microscopy, and scanning electron microscopy. Phase analysis is conducted using X-ray diffraction, while mechanical behavior is evaluated through hardness and tensile testing before and after heat treatment. The results reveal a strong correlation between heat input, microstructural evolution, and defect distribution. The findings provide valuable insights into process stability and quality challenges in WAAM of Nitinol and contribute toward establishing a reliable processing window for advanced aerospace and actuator applications.
📝 How to Cite
Sangat Naik, Dr.Srinagalakshmi Nammi,"Microstructural Analysis and Defect Characterization of WAAM-Fabricated Nitinol Shape Memory Alloy" International Journal of Scientific Research and Engineering Development, V9(1): Page(936-946) Jan-Feb 2026. ISSN: 2581-7175. www.ijsred.com. Published by Scientific and Academic Research Publishing.