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Characterization of Insulating Layer of Thermally Conductive Printed Circuit Board

	International Journal of Scientific Research and Engineering Development (IJSRED)	Full Text:
	Published Issue : Volume-3 Issue-6
	Year of Publication : 2020
	Unique Identification Number : IJSRED-V3I6P101
	Authors : Remesh Kumar K R, K. Shreekrishna Kumar
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Abstract :

Size reduction of the electronic devices is not possible with huge heat sinks. In this paper, a thermally conductive Printed Circuit Board (PCB) that can also act as a heat sink isdiscussed. This strategy helps to reduce the device size by removing large heat sinks. Here, a thermally conductive baseis needed for making thermally conductive PCB. Boron Nitride (BN) is an electrically insulating material which is thin filmed on a copper plate using RF sputtering. Then the band gap of BN film is calculated by using UV-Vis spectroscopy and also determined the resistance of the films using source meter. From the results, it is evident that the RF sputtering do not affects the band gap of BN film and it possess very large resistance.